The schematic structure of the new module concept is shown in Fig. 1. The module consists of a copper layer, a glass fibre sandwich foil (0.5mm FR4), a second copper layer, the solar cells, the encapsulation material and the cover material (down to top). The solar cells are series connected by solder or silver filled adhesives. The last bus bar is contacted either with a small copper band and solder or with an electrically conductive tape to the PCB. The solar cells are connected to the PCB with a nonconductive SMD adhesive for the chip assembly.

Such a module structure has the following advantages:

1. High module efficiencies (> 20%)

Because of the shingle technology the shading surface is reduced to a minimum. Depending on cell quality and packaging a module efficiency over 20% is possible.

2. Stable despite 1.5 mm thickness

Because of the printed circuit board and the fixed connection of the solar cells attached to it by the SMD adhesive, the solar module receives an extremely stable shape. For example, the module can fall from a height of 1.5 m to the ground, without any damage.

3. Only 1.5 mm module rim

A module rim of 1.5 mm outside the solar cells is necessary. This frame is necessary, in order to stick the packaging material to the PCB. Larger width is not used, since the device integrated module is not permanently exposed to wind and weather.

4. Variable position of the contacts on the back

Due to the double-sided structure of the printed circuit board it is possible to contact the module on the back in any place. The contacting can function in such a way that two spring loaded contacts press on two edge contacts of the module.

5. Aesthetic exterior

Apart from the purely technical advantages the shingle technology on printed circuit boards has a very even appearance (see Fig. 8).

Contacting